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INTEGRATED CIRCUITS
DATA SHEET
TDA8000; TDA8000T Smart card interface
Product specification Supersedes data of 1995 Feb 01 File under Integrated Circuits, IC02 1996 Dec 12
Philips Semiconductors
Product specification
Smart card interface
FEATURES * Two protected I/O lines * VCC regulation (5 V 4%, 100 mA max. with controlled rise and fall times) * VPP generation (12.5, 15 or 21 V 2.5%, 50 mA max. programmable by two bits, with controlled rise and fall times) * Clock generation (up to 8 MHz) * Short-circuit, thermal and card extraction protections * Two voltage supervisors (digital and analog supplies) * Automatic activation and deactivation sequences via an independent internal clock * Enhanced ESD protections on card connections (4 kV min.) * ISO 7816 approval. APPLICATIONS * Pay TV * Telematics * Cashless payment
TDA8000; TDA8000T
* Multipurpose card-readers, etc. GENERAL DESCRIPTION The TDA8000 is a complete, low-cost analog interface which can be positioned between a smart card or a memory card (ISO 7816) and a microcontroller. It is approved for banking, telecom and pay TV applications. The complete supply, protection and control functions are realized with only a few external components, which makes the TDA8000 very attractive for consumer applications. Application suggestions and support is available on request (see examples in Chapter "Application information").
QUICK REFERENCE DATA SYMBOL VDD IDD Vth2 VCC ICC VH IPP tde, tact Ptot PARAMETER supply voltage supply current threshold voltage on VSUP card supply voltage card supply current high voltage supply for VPP programming current deactivation/activation cycle duration continuous total power dissipation TDA8000; Tamb = +70 C; see Fig.10 TDA8000T; Tamb = +70 C; see Fig.11 Tamb operating ambient temperature read mode; VPP = 5 V write mode; VPP > 5 V idle mode; VDD = 12 V active modes; unloaded CONDITIONS - - 4.5 4.8 - - - - - - - 0 MIN. 6.7 - 25 32 - 5.0 - - - - - - - - TYP. MAX. 18 - - 4.68 5.2 -100 30 -50 -50 500 2 0.92 +70 UNIT V mA mA V V mA V mA mA s W W C
ORDERING INFORMATION TYPE NUMBER TDA8000 TDA8000T PACKAGE NAME DIP28 SO28 DESCRIPTION plastic dual in-line package; 28 leads (600 mil) plastic small outline package; 28 leads; body width 7.5 mm VERSION SOT117-1 SOT136-1
1996 Dec 12
2
Philips Semiconductors
Product specification
Smart card interface
BLOCK DIAGRAM
TDA8000; TDA8000T
handbook, full pagewidth
VSUP 15 ALARM ALARM 17 18
DELAY 16
VDD 13
GND 12 22
VOLTAGE SUPERVISOR
MAIN SUPPLY
CVNC
I/O1(C) I/O2(C) RSTIN
28 27 26 PROTECTIONS AND ENABLE
3 2 4
I/O1 I/O2 RST
TDA8000
19 OFF 20 START 21 WRITE INTERNAL CLOCK VCC GENERATOR LOGIC PROTECTIONS
9 8
PRES PRES
14 VCC
23 CLKDIV CLKOUT 25 CLOCK CIRCUITRY CLOCK ENABLE 5 CLK
PSEL1 PSEL2
6 7
VPP GENERATOR
10 VPP
OSCILLATOR 1 XTAL 24 CLKIN 11
MBH810
VH
Fig.1 Block diagram.
1996 Dec 12
3
Philips Semiconductors
Product specification
Smart card interface
PINNING SYMBOL PIN XTAL I/O2 I/O1 RST CLK PSEL1 PSEL2 PRES PRES VPP VH GND VDD VCC VSUP DELAY ALARM ALARM OFF START WRITE CVNC CLKDIV CLKIN CLKOUT RSTIN I/O2(C) I/O1(C) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 crystal connection data line to/from the card data line to/from the card card reset output clock output to the card programming voltage selection input (see Table 1) programming voltage selection input (see Table 1) card presence contact input (active LOW) DESCRIPTION
TDA8000; TDA8000T
fpage
card presence contact input (active HIGH) card programming voltage output high voltage supply for VPP generation ground positive supply voltage card supply output voltage voltage supervisor input external capacitor connection for delayed reset timing open-collector reset output for the microcontroller (active HIGH) open-collector reset output for the microcontroller (active LOW) interrupt output to the microcontroller (active LOW) microcontroller input for starting session (active LOW) control input for applying programming voltage to the card (active LOW) internally generated 5 V reference, present when VDD is on; to be decoupled externally (47 nF) input for dividing/not dividing the CLKOUT frequency by two (active LOW) external clock signal input clock output to the microcontroller, or another TDA8000 card reset input from the microcontroller (active HIGH) data line to/from the microcontroller; must not be left open-circuit, tie to CVNC if not used data line to/from the microcontroller; must not be left open-circuit, tie to CVNC if not used
XTAL 1 I/O2 2 I/O1 3 RST 4 CLK 5 PSEL1 6 PSEL2 7 PRES 8 PRES 9 VPP 10 VH 11 GND 12 VDD 13 VCC 14
MBH809
28 I/O1(C) 27 I/O2(C) 26 RSTIN 25 CLKOUT 24 CLKIN 23 CLKDIV
TDA8000 TDA8000T 21 WRITE
20 START 19 OFF 18 ALARM 17 ALARM 16 DELAY 15 VSUP
22 CVNC
Fig.2 Pin configuration.
1996 Dec 12
4
Philips Semiconductors
Product specification
Smart card interface
FUNCTIONAL DESCRIPTION Power supply The circuit operates within a supply voltage range of 6.7 to 18 V. VDD and GND are the supply pins. All card contacts remain inactive during power-up or power-down, provided VDD does not rise or fall too fast (0.5 V/ms typ.). POWER-UP The logic part is powered first and is in the reset condition until VDD reaches Vth1. The sequencer is blocked until VDD reaches Vth4 + Vhys4. POWER-DOWN When VDD falls below Vth4, an automatic deactivation of the contacts is performed. Voltage supervisor This block surveys the 5 V supply of the microcontroller (VSUP) in order to deliver a defined reset pulse and to avoid any transients on card contacts during power-up or power-down of VSUP. The voltage supervisor remains active even if VDD is powered-down. POWER-UP As long as VSUP is below Vth2 + Vhys2 the capacitor CDEL, connected to the pin DELAY, will be discharged. When VSUP rises to the threshold level, CDEL will be recharged. ALARM and ALARM remain active, and the sequencer is blocked until the voltage on the pin DELAY reaches Vth3. POWER-DOWN (see Fig.3) If VSUP falls below Vth2, CDEL will be discharged, ALARM and ALARM become active, and an automatic deactivation of the contacts is performed. Clock circuitry (see Fig.4) The clock signal (CLK) can be applied to the card by two different methods: 1. Generation by a crystal oscillator: the crystal (3 to 11 MHz) is connected to pin XTAL. Its frequency is divided by two. 2. Use of a signal frequency already present in the system and connected to the pin CLKIN (up to 8 MHz). Pin XTAL has to be connected to GND via a 1 k resistor. In this event, the CLKOUT signal remains LOW. 1996 Dec 12 5 IDLE MODE
TDA8000; TDA8000T
In both events the signal is buffered and enabled. Pin CLKOUT may be used to clock a microcontroller. The signal (12fxtal or fxtal if CLKDIV is HIGH) is available when the circuit is powered up. State diagram Once activated, the circuit has six possible modes of operation: * Idle * Activation * Read * Write * Deactivation * Fault. Figure 5 shows how these modes are accessible.
After reset, the circuit enters the IDLE state. A minimum number of circuits are active while waiting for the microcontroller to start a session: * All card contacts are inactive * Voltage generators are stopped * Oscillator is running, providing CLKOUT * Voltage supervisor is active * Pins I/O1(C) and I/O2(C) are high impedance. The OFF line is HIGH if a card is present (PRES and PRES active) and LOW if a card is not present. ACTIVATION SEQUENCE From the IDLE mode, the circuit enters the ACTIVATION mode when the microcontroller sets the START line (active LOW). The I/O(C) signals must not be LOW. The internal circuitry is activated, the internal clock starts and the following ISO 7816 sequence is performed: 1. VCC rises from 0 to 5 V 2. I/Os are enabled 3. VPP rises from 0 to 5 V 4. No change 5. CLK is enabled 6. RST is enabled. The typical time interval between two steps is 32 s for the first two steps and 64 s for the other three. Timing is derived from the internal clock (see Fig.6).
Philips Semiconductors
Product specification
Smart card interface
Between steps 3 and 5, a HIGH level on pin RSTIN allows the CLK signal to be applied to the card. This feature facilitates a precise count of CLK periods while waiting for the card to respond to a reset. After step 5, RSTIN has no further action on CLK. After step 6, RST is set to the complementary value of RSTIN. READ MODE When the activation sequence is completed and, after the card has replied to its Answer-to-Reset, theTDA8000 enters the READ mode. Data is exchanged between the card and the microcontroller via the I/O lines. When it is required to write to the internal memory of the card, the circuit is set to the WRITE mode by the microcontroller. Cards with EPROM memory require a programming voltage (VPP). VPP GENERATION The circuit supports cards with VPP of 12.5, 15 or 21 V. The selection of P is achieved by PSEL1 and PSEL2 according to Table 1. Table 1 Card programming voltage selection PSEL2 LOW HIGH LOW HIGH PROGRAMMING VOLTAGE P 5 12.5 15 21
TDA8000; TDA8000T
DEACTIVATION SEQUENCE (see Fig.8) When the session is completed, the microcontroller sets the START line to its HIGH state. The circuit then executes an automatic deactivation sequence by counting back the sequencer: 1. Card reset (RST falls to LOW) 2. CLK is stopped 3. No change 4. VPP falls to 0 V 5. I/O1(C) and I/O2(C) become high impedance 6. VCC falls to 0 V. The circuit returns to the IDLE mode on the next rising edge of the sequencer clock. PROTECTIONS Main fault conditions are monitored by the circuit: * Short-circuit on VCC * Short-circuit on VPP * Over current on I/Os * Card extraction during transaction * Overheating problem. When one of these fault conditions is detected, the circuit pulls the interrupt line OFF to its active LOW state and returns to the FAULT mode. FAULT MODE (see Fig.9) When a fault condition is written to the microcontroller via the OFF line, the circuit initiates a deactivation sequence. After the deactivation sequence has been completed, the OFF line is reset to its HIGH state when the microcontroller has reset the START line HIGH, except if the fault condition was due to a card extraction. Note The two other causes of emergency deactivation (Power failure detected on VDD or VSUP) do not act upon OFF.
PSEL1 LOW LOW HIGH HIGH
In order to respect the ISO7816 slopes, the circuit generates VPP by charging and discharging an internal capacitor. The voltage on this capacitor is then amplified by a power stage gain of 5, powered via an external supply pin VH [30 V (max.)]. WRITE MODE (see Fig.7) When the microcontroller sets the WRITE line (active LOW), the circuit enters the WRITE mode. VPP rises from 5 V to the selected value with a typical slew rate of 1 V/s. When the write operation is completed, the microcontroller returns the WRITE line to its HIGH state, and VPP falls back to 5 V with the same slew rate. WRITE has no action outside a session. 1996 Dec 12 6
Philips Semiconductors
Product specification
Smart card interface
TDA8000; TDA8000T
handbook, full pagewidth
Vth2 + Vhys2 Vth2
VSUP
VDELAY
Vth3
td
ALARM
MGG818
Fig.3 ALARM and DELAY as a function of VSUP (CDEL fixes the pulse width).
handbook, full pagewidth
ENABLE
CLK
CLKOUT
/2
ENCLK
CLKDIV
INPUT
OSC
INPUT
XTAL
CLKIN
MGG819
Fig.4 Clock circuitry.
handbook, full pagewidth
ACTIVATION
PDOWN
IDLE
FAULT
WRITE
READ
DEACTIVATION
MGG820
Fig.5 State diagram.
1996 Dec 12
7
Philips Semiconductors
Product specification
Smart card interface
TDA8000; TDA8000T
handbook, full pagewidth PRES
OFF tact START INTERNAL CLOCK SEQUENCER CLOCK VCC I/O VPP CLK ENABLE RESET RSTIN RST t3 t5 1 2 3 4 5 6 tRST
MGG821
td(clk) INTERNAL
Fig.6 Activation sequence.
handbook, full pagewidth
START (LOW) VCC (+5 V) WRITE (P)
(+5 V) VPP (0 V) CLK RST (HIGH)
MGG822
Fig.7 Read/Write; Read mode.
1996 Dec 12
8
Philips Semiconductors
Product specification
Smart card interface
TDA8000; TDA8000T
handbook, full pagewidth
tde START
OFF (HIGH) INTERNAL CLOCK SEQUENCER CLOCK VCC I/O VPP (+5 V) CLK ENABLE RESET RESET-IN RST INTERNAL
6
5
4
3
2
1
MGG823
Fig.8 Deactivation sequence after a normal session.
handbook, full pagewidth START
PRES OFF INTERNAL CLOCK SEQUENCER CLOCK VCC I/O VPP CLK ENABLE RESET RESET-IN RST 6 5 4 3 2 1
MGG824
INTERNAL
Fig.9 Deactivation after a card extraction during write mode.
1996 Dec 12
9
Philips Semiconductors
Product specification
Smart card interface
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD Vx1 supply voltage voltage on pins PSEL1, PSEL2, PRES, PRES, WRITE, START, OFF, ALARM and RSTIN voltage on pin VH voltage on pin VPP voltage on pin VSUP voltage on pins ALARM and DELAY voltage on pins XTAL, I/O1(C), I/O2(C), CLKIN, CLKOUT, CLKDIV and CVNC voltage on pins I/O1, I/O2, RST, CLK and VCC continuous total power dissipation duration < 1 ms PARAMETER CONDITIONS
TDA8000; TDA8000T
MIN. -0.3 -0.3
MAX. +18 VDD
UNIT V V
VH VPP VSUP Vx2 Vx3 Vx4 Ptot
-0.3 -0.3 -0.3 -0.3 -0.3 -0.3 - - -55 -4 -2
+30 VH +12 VSUP +6.0 +7.0 2 0.92 +150 +4 +2
V V V V V V W W C kV kV
TDA8000; Tamb = +70 C; note 1; see Fig.10 TDA8000T; Tamb = +70 C; note 1; see Fig.11
Tstg Ves
storage temperature electrostatic voltage on pins I/O1, I/O2, VCC, VPP, RST and CLK electrostatic voltage on other pins
Note 1. Ptot = VDD x (IDD(unloaded) + Isignals) + ICC x (VDD - VCC) + max.{(VH - VPP) x IPP(read) + (VH - VPP) x IPP(write)} + VH x IH(unloaded) + VSUP x ISUP + (VDD - CVNC) x ICVNC. Where `signals' means all signal pins used, excluding the supply pins.
1996 Dec 12
10
Philips Semiconductors
Product specification
Smart card interface
TDA8000; TDA8000T
handbook, halfpage
4
MBE256
handbook, halfpage
3
MBE255
P tot (W) 3
P tot (W) 2
2
1
1
0 50 0 50 100 150 Tamb ( o C)
0 50 0 50 100 150 Tamb ( o C)
Fig.10 Power derating curve (DIP28).
Fig.11 Power derating curve (SO28).
HANDLING Each pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining. Method 3015 (HBM 1500 , 100 pF) 3 pulses positive and 3 pulses negative; on each pin referenced to ground. THERMAL CHARACTERISTICS SYMBOL Rth j-a SOT117-1 SOT136-1 PARAMETER thermal resistance from junction to ambient in free air 30 70 K/W K/W VALUE UNIT
1996 Dec 12
11
Philips Semiconductors
Product specification
Smart card interface
TDA8000; TDA8000T
CHARACTERISTICS VDD = 12 V; VH = 25 V; VSUP = 5 V; fxtal = 7.16 MHz or fCLKIN = 3.58 MHz; Tamb = 25 C; unless otherwise specified. SYMBOL Supply VDD IDD supply voltage supply current idle mode; VDD = 8 V idle mode; VDD = 18 V active mode; unloaded Vth1 Vth4 Vhys4 VSUP ISUP Vth2 Vhys2 Vth3 IDEL VDEL IOH VOL IOL VOH td tpulse IOH VOL VIL VIH IIL IIH threshold voltage for power-on reset threshold voltage on VDD (falling) hysteresis on Vth4 supply voltage for the supervisor input current on VSUP threshold voltage on VSUP (falling) hysteresis on Vth2 threshold voltage on DELAY output current on DELAY voltage on pin DELAY pin grounded (charge) VDEL = 4 V (discharge) ALARM, ALARM (open-collector outputs) HIGH level output current on pin ALARM LOW level output voltage on pin ALARM LOW level output current on pin ALARM HIGH level output voltage on pin ALARM delay between VSUP and ALARM ALARM pulse width VOH = 5 V IOL = 2 mA VOL = 0 V IOH = -2 mA CDEL = 47 nF; see Fig.3 CDEL = 47 nF VOH = 5 V IOL = 1 mA - - - VSUP - 1 - 30 - - - 1.5 VIL = 0 V VIH = 5 V - - - - - - - - - - - - - - 25 0.4 -25 - 10 65 A V A V s ms A V 6.7 16 20 26 1.5 6.0 50 - - 4.5 10 2.35 -4 6 - - 22 28 32 3.0 - - 18 30 36 38 4.0 6.5 200 - 2 4.68 80 2.65 -2.5 - 3.5 V mA mA mA V V mV PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Voltage supervisor 5 1.6 - - - - - - V mA V mV V A mA V
Interrupt line OFF (open-collector) HIGH level output current LOW level output voltage 25 0.4
Logic inputs (RSTIN, START, WRITE, CLKDIV, PSEL1, PSEL2, PRES, PRES); note 1 LOW level input voltage HIGH level input voltage LOW level input current HIGH level input current 0.8 - -20 20 V V A A
1996 Dec 12
12
Philips Semiconductors
Product specification
Smart card interface
TDA8000; TDA8000T
SYMBOL
PARAMETER
CONDITIONS - IOL = 200 A IOH = -200 A IOH = -10 A RST enabled; see Fig.6 CL = 330 pF CL = 330 pF - 4.0
MIN. - - - - - - - - - - - - - - -
TYP.
MAX.
UNIT
Reset output to the card (RST) VIDLE VOL VOH tRST tr tf VIDLE VOL VOH output voltage in IDLE mode LOW level output voltage HIGH level output voltage delay between RSTIN and RST rise time fall time 0.4 0.45 VCC VCC 2 1 1 V V V V s s s
VCC - 0.7 - - - -
Clock output to card (CLK) output voltage in IDLE mode LOW level output voltage HIGH level output voltage IOL = 200 A IOH = -200 A IOH = -20 A IOH = -10 A tr tf / rise time fall time duty factor thermal drift on duty factor CL = 30 pF; note 2 CL = 30 pF; note 2 CL = 30 pF; (XTAL or CLKIN used); note 2 DIP and SO packages 0.4 0.4 VCC + 0.3 VCC + 0.3 VCC + 0.3 18 18 55 - V V V V V ns ns % %/K - 2.4 0.7VCC VCC - 0.7 - - 45 -
-0.07
Card programming voltage (VPP) P VPP selected voltage output voltage see Table 1 idle mode read mode write mode; IPP < 50 mA IPP output current read mode write mode write mode; VPP short-circuited to GND SR slew rate up or down High-voltage input (VH) VH IH input voltage input current at VH idle mode active mode; unloaded; WRITE = 0 P=5V P = 12.5 V P = 15 V P = 21 V VH - VPP voltage drop 3 5 6 8 - - - - - - 7 10 11 13 2.2 mA mA mA mA V - 2 - - 30 3 V mA - VCC - 4% - - - 0.80 - - - - - 1.0 0.4 VCC + 4% -50 -50 -400 1.20 V V mA mA mA V/s
P - 2.5%(3) -
P + 2.5%(3) V
1996 Dec 12
13
Philips Semiconductors
Product specification
Smart card interface
TDA8000; TDA8000T
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Card supply voltage (VCC) VCC output voltage idle mode active mode; ICC < 100 mA ICC SR output current VCC connected to GND slew rate up or down ICVNC < -15 mA 3 MHz < fi < 11 MHz; note 4 5 V reference output (CVNC) VCVNC Rxtal(neg) Vxtal fxtal fext VIL VIH IIL IIH CI fCLKOUT VOL VOH tr, tf output voltage at CVNC 4.5 - 3 3 5.0 - - - - - - - - - - - - - - - - -0.1 5.5 -300 4 11 V V MHz - 4.80 - - 0.80 - - - - 1.0 0.4 5.20 -100 -400 1.20 V V mA mA V/s
Crystal connection (XTAL) negative resistance at crystal DC voltage at crystal crystal resonant frequency
External clock input (CLKIN) frequency at CLKIN LOW level input voltage HIGH level input voltage LOW level input current HIGH level input current input capacitance VIL = 0 V VIH = 2 V note 2 0 0 1.5 - - - 8 0.8 5 -20 20 5 MHz V V A A pF
Clock output (CLKOUT) frequency on CLKOUT LOW level output voltage HIGH level output voltage rise and fall times duty factor IOL = 1 mA VOH = -200 A VOH = -10 A CL = 30 pF; note 2 CLKDIV = 0; CL = 30 pF; note 2 CLKDIV = 1; CL = 30 pF; note 2 / thermal drift on duty factor DIP and SO packages 1 - 3 4 - 45 40 - 8 0.4 - - 25 55 60 - MHz V V V ns % % %/C
1996 Dec 12
14
Philips Semiconductors
Product specification
Smart card interface
TDA8000; TDA8000T
SYMBOL
PARAMETER
CONDITIONS
MIN. -
TYP.
MAX.
UNIT
Data lines [I/O1, I/O2, I/O1(C), I/O2(C)]; note 5 VOH HIGH level output voltage on I/O 4.5 < VSUP < 5.5; 4.5 < VI/O(C) < 5.5; IOH = -20 A 4.5 < VSUP < 5.5; 4.5 < VI/O(C) < 5.5; IOH = -200 A VOL IIL LOW level output voltage on I/O II/O = 1 mA; I/O(C) grounded 4 VCC + 0.2 V
2.4
-
-
V
- - - 4 - - - - 10 17
- - - - - - - - - 20 -
65 -500 -5 VSUP + 0.2 70 -500 -5 0.4 - 23 1 - -230 -140 5
mV A mA V mV A mA V M k s C mA mA mA s s s
LOW level input current on I/O(C) I/O(C) grounded; II/O = 0 I/O(C) grounded; I/O connected to VCC
VOH VOL IIL
HIGH level output voltage on I/O(C) LOW level output voltage on I/O(C) LOW level input current on I/O
4.5 < VI/O < 5.5 II/O(C) = 1 mA; I/O grounded I/O grounded; II/O(C) = 0 I/O grounded; I/O(C) connected to VSUP
VIDLE ZIDLE Rpu tr, tf Tsd ICC(sd) IPP(sd) II/O(sd) Timing tact tde t3
voltage on I/O outside a session impedance on I/O(C) outside a session internal pull-up resistance between I/O and VCC rise and fall times Ci = Co = 30 pF
- - -175 -90
Protections shut-down local temperature shut-down current at VCC shut-down current at VPP shut-down current at I/O from I/O to I/O(C) 135 - - - - - -
3
activation sequence duration deactivation sequence duration start of the window for sending CLK to the card
see Fig.6 see Fig.8 see Fig.6
250 250 -
500 500 140
1996 Dec 12
15
Philips Semiconductors
Product specification
Smart card interface
TDA8000; TDA8000T
SYMBOL t5 tst td(clk) Notes
PARAMETER
CONDITIONS
MIN. 160 - - - -
TYP. - 30 2
MAX.
UNIT s s s
end of the window for sending CLK see Fig.6 to the card maximum pulse width on START before VCC starts rising delay between RSTIN and CLK see Fig.6
-
1. START, WRITE, CLKDIV and PRES are active LOW; RSTIN and PRES are active HIGH. t1 2. The transition time and duty factor definitions are shown in Fig.12; = -------------- . t1 + t2 3. P is the card programming voltage set by pins PSEL1 and PSEL2. 4. This condition ensures correct start-up of the oscillator with crystals having series resistance up to 100 . 5. The path between I/O and I/O(C) is as follows (see Fig.13): a) Clamp to VCC. b) 20 k pull-up resistor to VCC; thus VOH on I/O. c) Two opposite npn transistors with sensing pnp transistor. d) Clamp to VSUP; thus VOH on I/O(C). e) The base current of the npn transistor is decreasing when their collector current increases. This means the voltage drop is very low for small currents and becomes maximum for some mA. Thus VOL on I/O and I/O(C), current limits, and high impedance feature. The output current from I/O and I/O(C) when the line is open-circuit is the sum of the pull-up current and the base currents.
handbook, full pagewidth
tr 90%
tf 90% VOH 1.5 V
10% t1
10% t2
MBH856
VOL
Fig.12 Definition of transition times.
1996 Dec 12
16
Philips Semiconductors
Product specification
Smart card interface
INTERNAL PIN CONFIGURATION
TDA8000; TDA8000T
handbook, full pagewidth
VSUP 100 A
XTAL 100 A VCC 20 k I/O2 I/O1 VCC 5 k 100 VCC 5V 7 k 20 k CLKOUT VCC 100 A 100 A 5V as PSEL1 RSTIN 100 A
I/O1(C) I/O2(C)
RST
1.5 V
CLKIN
TDA8000
VCC 10 k 50 VCC
VDD 400 A as PSEL1 CLKDIV CVNC 1350 650 as PSEL1 as PSEL1 WRITE START OFF
CLK
20 A 1.25 V
PSEL1
ALARM VH 210 PSEL2 PRES PRES VPP 2.5 k VH GND VDD 625 250 20 A VCC 1.25 k 1.25 V 1.25 k 5310
MBE254
VSUP
VSUP 100 A 10 k 2.5 V 10 k ALARM 2.5 V 2.5 A DELAY
as PSEL1 as PSEL1 as PSEL1
VDD
100 A
20 A VSUP 4690
Fig.13 Internal pin configuration.
1996 Dec 12
17
Philips Semiconductors
Product specification
Smart card interface
APPLICATION INFORMATION
TDA8000; TDA8000T
handbook, full pagewidth
5V 47 nF VCC 10 F VSUP DELAY
12 V 22 F VDD GND
RST
ALARM ALARM VOLTAGE SUPERVISOR MAIN SUPPLY CVNC 100 nF I/O1(C) CVNG I/O2(C) RSTIN PROTECTIONS ENABLE I/O1 I/O2 RST
PORT 1
PRES
TDA8000
PRES
OFF START INT 1 WRITE
LOGIC
PROTECTIONS VCC GENERATOR VCC C1 5.6 V C2 C6 C5
INTERNAL CLOCK
CLKDIV 80C51 MICROCONTROLLER CLKOUT CLOCK CIRCUITRY CLOCK ENABLE CLK C3 C7
C4 PSEL1 PSEL2 OSC VPP GENERATOR VPP
C8
CARD SOCKET
MGG825
XTAL 1 k CLKIN 3.58 MHz
VH 25 V
Fig.14 Typical application within a consumer product.
1996 Dec 12
18
Philips Semiconductors
Product specification
Smart card interface
TDA8000; TDA8000T
handbook, full pagewidth
100 nF
12 V 25 V (1)
VDD
RST INT1
ALARM ALARM VSUP CVNC VDD OFF
VH PRES
START
PRES VCC C1
WRITE SDA I2C SCL COM PORT PORT 1 RSTIN
RST I/O1(C) I/O2(C) PSEL1 TDA8000 CLK
C2
C3 C4
12 V 10 F 80C51 MICROCONTROLLER
PSEL2 CVNC CLKDIV C5
25 V 10 F XTAL1 XTAL2 GND I/O2 GND DELAY 47 nF GND CLKIN XTAL 7.16 MHz C8 CARD SOCKET
MGG826
CLKOUT
VPP I/O1
C6 C7
(1) If pin VH is not connected to 25 V, it should be connected to VDD.
Fig.15 Application in a remote card reader; the microcontroller is clocked and powered by the TDA8000 interface is achieved via the I2C-bus.
1996 Dec 12
19
Philips Semiconductors
Product specification
Smart card interface
PACKAGE OUTLINES
handbook, plastic dual in-line package; 28 leads (600 mil) DIP28: full pagewidth
TDA8000; TDA8000T
SOT117-1
seating plane
D
ME
A2
A
L
A1 c Z e b1 b 28 15 MH wM (e 1)
pin 1 index E
1
14
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 5.1 0.20 A1 min. 0.51 0.020 A2 max. 4.0 0.16 b 1.7 1.3 0.066 0.051 b1 0.53 0.38 0.020 0.014 c 0.32 0.23 0.013 0.009 D (1) 36.0 35.0 1.41 1.34 E (1) 14.1 13.7 0.56 0.54 e 2.54 0.10 e1 15.24 0.60 L 3.9 3.4 0.15 0.13 ME 15.80 15.24 0.62 0.60 MH 17.15 15.90 0.68 0.63 w 0.25 0.01 Z (1) max. 1.7 0.067
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT117-1 REFERENCES IEC 051G05 JEDEC MO-015AH EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-14
1996 Dec 12
20
Philips Semiconductors
Product specification
Smart card interface
TDA8000; TDA8000T
SO28: plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
D
E
A X
c y HE vMA
Z 28 15
Q A2 A1 pin 1 index Lp L 1 e bp 14 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 18.1 17.7 0.71 0.69 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 0.42 0.39 L 1.4 0.055 Lp 1.1 0.4 0.043 0.016 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT136-1 REFERENCES IEC 075E06 JEDEC MS-013AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 91-08-13 95-01-24
1996 Dec 12
21
Philips Semiconductors
Product specification
Smart card interface
SOLDERING Plastic dual in-line packages BY DIP OR WAVE The maximum permissible temperature of the solder is 260 C; this temperature must not be in contact with the joint for more than 5 s. The total contact time of successive solder waves must not exceed 5 s. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified storage maximum. If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron below the seating plane (or not more than 2 mm above it). If its temperature is below 300 C, it must not be in contact for more than 10 s; if between 300 and 400 C, for not more than 5 s. Plastic small outline packages BY WAVE During placement and before soldering, the component must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 C within 6 s. Typical dwell time is 4 s at 250 C.
TDA8000; TDA8000T
A modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications. BY SOLDER PASTE REFLOW Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow. Dwell times vary between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min at 45 C. REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE-HEATED SOLDER TOOL)
Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must be limited to 10 s at up to 300 C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and 320 C. (Pulse-heated soldering is not recommended for SO packages.) For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package placement.
1996 Dec 12
22
Philips Semiconductors
Product specification
Smart card interface
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8000; TDA8000T
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1996 Dec 12
23
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580/xxx France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 247 9145, Fax. +7 095 247 9144 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1, P.O. Box 22978, TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1996
Internet: http://www.semiconductors.philips.com
SCA52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
537021/1200/04/pp24
Date of release: 1996 Dec 12
Document order number:
9397 750 01383

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